UHV Multi-Sources PVD

PVD Products manufactures complete integrated sputtering systems to meet your specific deposition requirements.  These systems can be configured with multiple RF and/or DC magnetron sources ranging in size from 1 inch (25 mm) to 8 inches (200 mm) in diameter.   We can provide systems to handle wafers up to 300 mm in diameter, heating up to 900°C and RF bias with additional ports for diagnostics such as Reflection High-Energy Electron Diffraction (RHEED), ellipsometry, and Multi-beam Optical Sensors (MOSS) for in-situ stress measurement.

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Sputtering Chamber Configurations
Magnetron sputtering chambers are available in either cylindrical or rectangular geometries and sputter-up or sputter-down configurations.

Rectangular chambers are designed with a hinged door to provide easy access to the chamber interior.

Cylindrical chambers are accessed through a large flat flange that is lifted from the chamber via an electric hoist.

The Viton O-ring seals are differentially pumped to achieve pressures as low as 1.0 x 10-9 Torr.

All chambers are supplied with a set of internal 304 Stainless Steel shields that are easily removed for periodic cleaning of excessive film deposits.
Up to six magnetron sources are mounted on separate ConFlat flanges arranged in a confocal array where each source is directed at a point slightly above the substrate target and at an angle of roughly 30 degrees from the substrate normal for optimal deposition uniformity.