Organic/inorganic etching made possible under atmospheric pressure
Display, mobile phone, semiconductor, glass, film, polymer etc
Organic/inorganic etching, until now only available in vacuum chambers, was made possible under atmospheric pressure.
Special plasma head plus unique discharge system makes the etching process possible under atmospheric pressure, lowering defect rates and thus increasing yields.
Features
Etching, ashing, and removal of residual layers of PR
– modules can be attached without modifying the production lines, resulting in higher yields.
Application
– Over deposition metal etching
– A-Si / Poly-Si / PI / PR ashing
– Si / SiO2 selective etching
